PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board in which a heat contained in an insulating layer is effectively transmitted to a heat dissipation layer and heat dissipation effect can be improved by coating the heat dissipation layer with a high heat conductive heat dissipation coating layer.

SOLUTION: The printed circuit board comprises: the insulating layer; a circuit pattern formed in one surface of the insulating layer; an interlayer conducting part which penetrates through the insulating layer and is coupled to the insulating layer to be electrically connected to the circuit pattern; the heat dissipation layer laminated in the other surface of the insulating layer; and the heat dissipation coating layer which is interposed between the insulating layer and the heat dissipation layer to be electrically connected to the interlayer conducting part. The heat contained in the insulating layer is effectively transmitted to the heat dissipation layer and heat dissipation effect can be improved.

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