CIRCUIT BOARD AND METHOD FOR PACKAGING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a circuit board in which cavity causing short circuit between adjoining electrodes can be prevented from occurring, and to provide a method for packaging an electronic component.

SOLUTION: Thermosetting resin 30 applied onto a resist film 13 in order to bond an electronic component 20 is pressed by the lower surface of the electronic component 20 at the time of thermo compression bonding of the electronic component 20 to a circuit board 10 and spread to the electrode 12 side. A level difference portion 16 for hooking a void 40 generated in the thermosetting resin 30 is formed in the resist film 13 applied to this side of an opening 15.

COPYRIGHT: (C)2008,JPO&INPIT