| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device for more securely preventing that an element that is formed on an insulating substrate is subject to electrostatic faults such as electrostatic discharge and dust adhesion, due to an electrostatic attraction force by static electricity that is generated in a substrate manufacturing process, and to provide a manufacturing apparatus of the semiconductor device. SOLUTION: A manufacturing apparatus 100 of a semiconductor device has: a holding member for holding a substrate to be treated with a chemical solution, a chemical solution supply nozzle 11 for supplying the chemical solution for treating the substrate with the chemical solution to the surface of the substrate, and a nozzle 7 for substrate surface for supplying first wash water and second wash water with the smaller specific resistance than the first wash water to the surface of the substrate. After supplying the chemical solution to the surface of the substrate by the chemical solution supply nozzle 11 to treat it with the chemical solution, the first wash water is supplied to the surface of the substrate by the nozzle 7 for the substrate surface. After that, the second wash water is supplied in place of the first wash water. COPYRIGHT: (C)2008,JPO&INPIT
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