发明名称 APPARATUS FOR PROCESSING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for achieving drainage even under reduced pressure, and increasing throughput by adjusting the pressure inside and outside the chamber while a substrate is processed in a clean state. SOLUTION: By using a control unit 71, the inside of a chamber 23 is made to be in a solvent atmosphere, a substrate W is moved from a processing position to a drying position, and the inside of the chamber 23 is reduced in pressure to first pressure PS1 by a second vacuum pump 48. A third vacuum pump 65 is operated until the processing liquid is discharged to a buffer tank 53, so that the pressure inside the buffer tank 53 is made to second pressure PS2, which is not more than the first pressure PS1. In this way, even under pressure-reduction solvent atmosphere, the processing liquid can be discharged from an inner tube 3 to the buffer tank 53, and the throughput can be increased. In addition, since the pressurization inside a chamber 23 is unnecessary, so the substrate W can be dried in a clean state without bad influence by pressurization. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008004874(A) 申请公布日期 2008.01.10
申请号 JP20060175331 申请日期 2006.06.26
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 AIHARA TOMOAKI
分类号 H01L21/304;H01L21/306 主分类号 H01L21/304
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