发明名称 MICROELECTROMECHANICAL ELEMENT, MICRO ELECTROMECHANICAL ELEMENT ARRAY, MODULATOR AND IMAGE FORMING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a microelectromechanical element in which various problems such as a trouble accompanied by a high speed, an increase in a driving voltage, a complicated structure and the occurrence of a hinge remaining strain are reduced, to provide a microelectromechanical element array, a modulator and an image forming apparatus, thus to provide a high speed response and a low voltage driving, to simplify a design, and to improve an operation reliability. SOLUTION: The microelectromechanical element 100 with a modulation function responding to the displacement operation of a movable part 15 has: the flat plate movable part 15; a support 27 erected on a substrate 11; a supporting part 17 which allows the support 27 to support the movable part 15; and fixed electrodes 19 and 21 which are arranged facing to the movable part 15 and give physical acting force upon the movable part 15, wherein the supporting part 17 supports the movable part 15 when a shaft 25 arranged at the position of the gravity center line of the movable part 15 is engaged in a housing hole 23 into which the shaft 25 is inserted with a gap with the hole. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008003310(A) 申请公布日期 2008.01.10
申请号 JP20060172694 申请日期 2006.06.22
申请人 FUJIFILM CORP 发明人 OGIKUBO SHINYA
分类号 G02B26/08;B81B3/00;H04N1/036 主分类号 G02B26/08
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