| 摘要 |
A superfine-circuit semiconductor package structure includes a carrier board, a support board having at least one through hole and mounted on the carrier board, at least one semiconductor chip received in the through hole of the support board and mounted on the carrier board, at least one circuit built-up structure electrically connected to the semiconductor chip and formed on the support board and the semiconductor chip, wherein the circuit built-up structure includes at least two insulating layers, a plurality of conductive vias formed in the lower insulating layer, circuit layer electrically connected to the conductive vias and flush with the upper insulating layer, and a plurality of conductive elements mounted on the circuit built-up structure, such that the semiconductor chip can be electrically connected to an external device through the circuit built-up structure and the conductive elements.
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