发明名称 System for the Placement of Modular Fill Material Forming Co-Joined Assemblies
摘要 A system for the placement of modular fill material forming co joined assemblies that promotes increased efficiency in fill material building methods by utilizing the capabilities of aerial conveyance devices, the pre-assembly of forms, the rapid bracing of forms, and the sequential placement of enclosure forms.
申请公布号 US2008006006(A1) 申请公布日期 2008.01.10
申请号 US20050572203 申请日期 2005.07.15
申请人 THERMOFORMED BLOCK CORP. 发明人 BARNET ROBERT T.;BARNET BRADLEY J.;DWORKES DONALD H.
分类号 E04C2/54;E04B2/86;E04G21/14 主分类号 E04C2/54
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