Component passivation device, has barrier connected with carrier substrate for forming inner area of housing by connecting areas, where one of connecting areas has large distance relative to other connecting area

摘要

The device (10) has a barrier (50) with a connecting area (52), and a carrier substrate (40) with another connecting area that is opposite to the former connecting area. The barrier is connected with the carrier substrate for forming an inner area (31) of a housing (30) by the connecting areas. A component (20) is provided to be arranged within the inner area of the housing. The housing is provided in a hermetically closed manner, where the former connecting area has a larger distance in a partial area relative to the latter connecting area in another partial area. An independent claim is also included for a method for manufacturing of a device for passivation of a component.