AN APPARATUS FOR REPAIRING USING AN LASER HAVING A PART FOR REMOVING PARTICLES

摘要

A laser repair device is provided to remove particles from a rear surface of a wafer by using a particle remover, which is implemented on a pre-alignment device. A laser repair device includes a wafer loader(110), a pre-alignment device(120), a particle remover(125), and a laser repair unit(130). Plural wafers are mounted on the wafer loader after a test process. The pre-alignment device receives the wafers from the wafer loader and aligns flat zones of the respective wafers with each other. The particle remover is implemented in the pre-alignment device and removes particles from a rear surface of the wafer. The laser repair unit irradiates a laser beam on a desired position of the aligned wafers, such that defective cells are repaired.