| 摘要 |
Equipment for inspection of an edge exposure area of a wafer is provided to inspect a breakage or a crack of the edge exposure of the wafer through an image. Equipment for inspection of an edge exposure area of a wafer(20) includes an electronic column(10), a detecting member, and a processing member. The electronic beam emitted from the electronic column is radiated to the wafer. The detecting member detects electrons discharged from the radiated electronic beam. The processing member analyzes data on the detected electrons. The electronic column is a multiple electronic column. The electronic column is a micro electronic column. The detecting member detects at least one of sample current, secondary electron, or back-scattered electrons.
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