| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board which can effectively and externally transmit heat generated from an electronic component which works at a large current. <P>SOLUTION: In a wiring board, a mounting part 1a for mounting an electronic component 3 is provided on a base 1, and a wiring 2 is provided whereto an electrode of the electronic component 3 is connected. The wiring 2 consists of a composite material wherein at least either particle 2a of diamond or particle 2a of cubic boron nitride is incorporated in a metal 2b. Heat can be dissipated via the wiring 2 from the electronic component 3 by the wiring 2 consisting of the composite material which is excellent in heat conductivity. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
