| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a support which is capable of restraining solder balls from being generated and improved in heat dissipating properties. <P>SOLUTION: The support for mounting a semiconductor device is equipped with a metal member, and an insulating board where the metal member is arranged. Further, the mounting support is provided with a main surface with a mounting area where the semiconductor device is arranged, a rear surface opposite to the main surface, and two or more corners provided to the adjacent side surfaces that connect the rear surface and the main surface. Especially, the above support is equipped with cutouts 101a and 101b which are provided between the adjacent corners by partially cutting them out from the side to the rear surface of the support. The two corners of each of the nearly rectangular metal members 201b and 202b extend from the cutouts 101a and 101b to the center of the rear surface respectively, confront each other at the center of the rear surface of the support, and are chamfered in the plan view of the rear surface of the support. <P>COPYRIGHT: (C)2008,JPO&INPIT |
