| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method according to which, when solder resist ink having a low viscosity is used in implementing an ink jet method, the solder ink does not flow out from an angled part of a conductive layer to keep a solder resist layer on the angled part of the conductive layer at a desired thickness. SOLUTION: The manufacturing method for a printed wiring board includes a step of forming the conductive layer (2) having an angled part (2a) on the board (1), a step of making the angled part (2a) of the conductive layer (2) into a curved shape (2b) following the previous step, and a step of applying solder resist ink by the inkjet method to a spot at least including the curved shape (2b) on the board (1) and the conductive layer (2) to form the solder resist layer (3) following the previous step. At the step of making the curved shape (2b), the radius of curvature (r) of the curved shape (2b) is determined to be one-third or more of the thickness (h) of the conductive layer (2). COPYRIGHT: (C)2008,JPO&INPIT
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