| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of supplying a sulfic acid/hydrogen peroxide mixture solution having a liquid temperature suitable for peeling of a resist to a substrate. SOLUTION: A second supply piping 24 is connected to a first supply piping 13 connected between a mixing valve 12 and an SPM nozzle 3 while bypassing a first switching valve 20 interposed on the first supply piping 13. A second switching valve 25 is interposed on the second supply piping 24. If the liquid temperature of the SPM flowing through the first supply piping 13 is not less than a predetermined reference temperature, the first switching vale 20 is opened and the second switching valve 25 is closed, and the SPM is supplied to the SPM nozzle 3 only through the first supply piping 13. If the liquid temperature of the SPM flowing through the first supply piping 13 is less than the predetermined reference temperature, the second switching valve 25 is opened and the first switching valve 20 is closed, and the SPM flows into the second supply piping 24 in a midway point of the first supply piping 13. COPYRIGHT: (C)2008,JPO&INPIT
|
