POLISHING PAD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad which improves flattening performance without lowering a polishing speed and wear resistance, a manufacturing method for the polishing pad and a manufacturing method for a semiconductor device using the polishing pad.

SOLUTION: The polishing pad has a polishing layer 2 formed of a polyurethane foaming body in the concave section of a concave highly-elastic layer 3 in a firmly-stuck state. The highly-elastic layer is formed of a non-foaming body, and the elastic modulus of the highly-elastic layer is greater than the elastic modulus of the polishing layer by 10 MPa or larger.

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