| 摘要 |
A terminal ( 1 ) for an IC socket includes a mounting end ( 11 ) adapted to be mounted onto a substrate. The mounting end includes a bottom surface ( 110 ) and a side surface ( 113 ). A recess ( 111 ), on a first region of the bottom surface, is adapted for a body of reflowable, electrically conductive material to be fused thereon. A channel ( 112 ), on a second region of said bottom surface, extends from the side surface to the recess. The providence of the channel allows the vapored flux material to be laterally dissipated through the channel, thereby having no formation of one or more voids within the mass of reflowable, electrically conductive material, during the reflowable process.
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