| 摘要 |
An apparatus and a method for forming a conductive pattern on a substrate are provided to form the conductive pattern on a substrate having a low heat resistance at the time of forming the conductive pattern by the use of a conductive pattern maintaining substrate. An apparatus for forming a conductive pattern on a substrate includes a unit for preparing a pattern on a top surface of a member, a unit for forming a conductive pattern precursor by supplying a conductive particle dispersing solution to the pattern, a unit for imaging the conductive pattern precursor formed on the member by electrically connecting a conductive pattern maintaining substrate(8), a unit for forming the conductive pattern by heating the imaged conductive pattern, and a unit for imaging the conductive pattern to a target substrate by releasing the conductive pattern and the adhesion layer from the conductive pattern maintaining substrate. An adhesion layer(22) is formed on a conductive base layer(21). The apparatus for forming the conductive pattern on the substrate forms the conductive pattern precursor on a surface of the member in advance and forms the conductive pattern on the target substrate from the member. |
