| 摘要 |
<p>A substrate processing apparatus is provided to anneal a surface of substrate irrespective of the flow of gas at a bottom surface of the substrate by annealing the substrate while transferring the substrate. A substrate processing apparatus(1) includes a substrate holding plate(12), a temperature controlling member, and a transferring member. The substrate holding plate holds a substrate(90) on a top surface of the substrate holding plate by a non-contact method by discharging gas from a plurality of discharge holes(12a) formed on the top surface. The temperature controlling member controls a temperature of the substrate being held on the top surface of the substrate holding plate by the non-contact method. The transferring member transfers the substrate held on the top surface of the substrate holding plate by the non-contact method along the top surface.</p> |
