| 摘要 |
<p>The invention relates to a lead-free, low-melting glass for covering a substrate. This glass contains 0.1-25 wt% of SiO2, 1-50 wt% of B2O3, 1-45 wt% of ZnO, 20-90 wt% of Bi2O3, 0.1-40 wt% of V2O5, 0-5 wt% of Nb2O5, 0-20 wt% of R2O where R is Li, Na or K, and 0-20 wt% of RO where R is Mg, Ca, Sr or Ba. This glass has a thermal expansion coefficient of from 65 x 10<-7>/ DEG C to 100 x 10<-7>/ DEG C within a range of 30-300 DEG C; and has a softening point of not higher than 630 DEG C.</p> |
