| 摘要 |
A method for manufacturing a PCB(Printed Circuit Board) and the PCB manufactured using the same are provided to reduce electric losses such as increase of impedance resistance value, decrease of current efficiency, and an electromagnetic interference. A method for manufacturing a PCB includes the steps of: (a) forming a dry film opening portion for forming a contact circuit by closely contacting, exposing and developing a dry film containing a photoresist on a copper foil surface; (b) forming a copper plated layer in the dry film opening portion and forming a contact circuit which is a first metal layer obtained by peeling the dry film other than the copper plated layer; (c) forming an external circuit closely contacting, exposing, and developing a dry film containing the photoresist on the contact circuit; and (d) forming a second metal layer by electroless plating or electro plating so as to improve electroconductivities of the contact circuit and the external circuit.
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