| 摘要 |
<p>A baking apparatus for flowing photoresist and a method of flowing the photoresist are provided to prevent the rework of a wafer by preventing a process failure from occurring. A baking apparatus for flowing photoresist includes a rotation driving unit(160), a heater unit(130), and a measurement unit(170). The rotation driving unit includes a rotation chuck(162). The rotation chuck rotates a wafer(112). A photoresist pattern is formed on the wafer. The heater unit supplies thermal energy to the wafer. The measurement unit controls a rotation speed of the wafer. The heater unit includes sub-blocks. Each of the sub blocks can control a temperature. Each of the sub-blocks includes a hot wire(134) and a temperature sensor(136). The hot wire heats the wafer and the temperature sensor detects a temperature of the wafer. The thermal energy is uniformly transferred to the wafer from the heater unit according to the rotation of the wafer on which the photoresist pattern is formed. Further, the measurement unit measures a rotation speed of the wafer by using a test wafer.</p> |
