<p>The microstructure cooler has a stack of at least two metal films (1) and a base plate (5) for contacting the object (4) to be cooled via a thermal contact surface (6). The base plate and metal foils are connected by material locking and coolant channels (2) are provided in the metal films with breadths from 100 to 2000 microns, depths from 25 to 1000 microns and mean separation from 50 to 1000 microns.</p>
申请公布号
EP1406297(B1)
申请公布日期
2008.01.09
申请号
EP20030090048
申请日期
2003.02.25
申请人
ATOTECH DEUTSCHLAND GMBH
发明人
MEYER, HEINRICH;CRAEMER, KONRAD;KURTZ, OLAF;PRECHTL, PETER;THEISEN, SVEN;HOEHN, MARKUS;HERBER, RALPH, DR.