<p>Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.</p>
申请公布号
EP1876261(A1)
申请公布日期
2008.01.09
申请号
EP20070252709
申请日期
2007.07.05
申请人
ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C.
发明人
POOLE, MARK A.;COBLEY, ANDREW J.;SINGH, AMRIK;HIRST, DEBORAH V.
