MOLDED LEAD FRAME CONNECTOR WITH ONE OR MORE PASSIVE COMPONENTS

摘要

Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a conductive lead structure that is il encased in a plurality of polymer casings. The polymer casings provide electrical insulation for the conductors in the lead frame as 1 well as mechanical support for the finished component One or more passive components can mount to the conductors of the lead j frame connector to aid with impedance matching between an optical sub-assembly, the lead frame connector, and the printed circuit j board. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish Connectivity between the optical sub-assembly and the printed circuit board.