| 发明名称 |
METHOD AND SYSTEM OF HEAT CONDUCTOR |
| 摘要 |
<p>The present invention relates to surface mount assembly of electronic equipment. More especially it relates to mounting of high frequency electronic components for efficient cooling also with low cost circuit boards. Particularly it relates to efficiently transporting heat and eliminating air gaps in microwave equipment.</p> |
| 申请公布号 |
EP1875786(A1) |
申请公布日期 |
2008.01.09 |
| 申请号 |
EP20050718798 |
申请日期 |
2005.04.25 |
| 申请人 |
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) |
发明人 |
TAGEMAN, OLA;LIGANDER, PER |
| 分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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