<p>Electroless copper and copper alloy plating baths comprising one or more chelating agents chosen from hydantoin and hydantoin derivatives and pyruvaldehyde are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.</p>
申请公布号
EP1876259(A2)
申请公布日期
2008.01.09
申请号
EP20070252711
申请日期
2007.07.05
申请人
ROHM AND HAAS ELECTRONIC MATERIALS, LLC
发明人
POOLE, MARK A.;COBLEY, ANDREW J.;SINGH, AMRIK;HIRST, DEBORAH V.