PREPARATION METHOD OF PLASTIC CONDUCTIVE PARTICLES HAVING MULTI-COATING LAYER FOR ELECTRONIC PACKAGE AND PLASTIC CONDUCTIVE PARTICLES MANUFACTURED THEREBY

摘要

A method for fabricating a plastic solder ball for an electronic package with multilayered metal layers is provided to improve endurance with respect to thermal stress while increasing mechanical strength by forming a metal conductive layer on the outer circumferential surface of a plastic bead and by alternately stacking a unary metal selected from Sn or Ag by an electroplating method to form a solder layer of a multilayered structure. At least one kind of a metal conductive layer is formed on the outer circumferential surface of a plastic bead. A solder layer is formed on the metal conductive layer. The solder layer is formed of a multilayered structure in which a unary metal selected from Sn or Ag is alternately stacked. A heat treatment process is additionally performed at a temperature of 100-300 °C for a time interval of 30 minutes to 20 hours.