| 摘要 |
<p>A stackable cassette (21) for testing at least one separate wafer during the processing of a plurality of semiconductor wafers is disclosed. The stackable cassette (21) includes a bottom surface (25) which conforms to a top surface (3) of a base cassette (1) having a plurality of wafers. In addition, the stackable cassette (21) includes two or more supports (27) which extend vertically from the bottom surface (25) and a top surface (23) horizontally connected to the two supports (27). The supports include ribs (31) which form channels for holding at least one wafer. When processing the plurality of wafers, the stackable cassette (21) is placed on top of a base cassette (1). A specified processed wafer is placed within the stackable cassette (21). The stackable cassette (21) is then removed for inspection of the test wafer.</p> |
