| 摘要 |
A semi additive process for manufacturing a printed circuit board is provided to minimize a process failure by enabling deep and even cooper etching by removing a minute scum and a residual yarn, and reforming a surface. A semi additive process method for manufacturing a printed circuit board includes the steps of: improving an adhesion force of a DFR through removal of minute foreign materials and reformation of a surface of the insulating substrate by coating or casting both surfaces or one surface of a PI or the insulating substrate with a conducive film including a copper and plasma processing the surfaces before laminating the DFR on the surface(S110); performing a descum and a surface reformation by plasma processing a surface between DFR patterns and a DFR pattern walls(30) after the DFR patterns are formed(S140); performing the descum and the surface reformation by forming a circuit by copper-plating a portion between the plasma-processed pattern walls and plasma processing an exposed substrate surface and a copper-plated surface after removing the pattern walls with leaving the only copper on the substrate through first etching(S170); and completing an electric circuit by finally etching the plasma processed substrate(S180). |
