发明名称 |
ELECTROLYTIC COPPER FOIL AND PROCESS FOR PRODUCING ELECTROLYTIC COPPER FOIL, SURFACE TREATED ELCTROLYTIC COPPER FOIL USING SAID ELECTROLYTIC COPPER FOIL, AND COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD USING SAID SURFACE TREATED ELECTROLYTIC COPPER FOIL |
摘要 |
<p>It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super lowprofile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.</p> |
申请公布号 |
EP1876266(A1) |
申请公布日期 |
2008.01.09 |
申请号 |
EP20060730868 |
申请日期 |
2006.03.31 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
MATSUDA, MITSUYOSHI TD;SAKAI, HISAO;TOMONAGA, SAKIKO LTD;DOBASHI, MAKOTO LTD |
分类号 |
C25D1/04;C25D1/00;C25D3/38;C25D5/48;H05K1/03;H05K1/09 |
主分类号 |
C25D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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