| 发明名称 |
POLISHING SLURRY AND POLISHING MATERIAL USING SAME |
| 摘要 |
Disclosed is a polishing slurry which enables to suppress damages to the foundation while securing an adequate polishing rate. The polishing slurry contains a resin (A) having an amide group and an organic resin (B).
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| 申请公布号 |
KR20080004598(A) |
申请公布日期 |
2008.01.09 |
| 申请号 |
KR20077026219 |
申请日期 |
2006.04.14 |
| 申请人 |
MITSUI CHEMICALS, INC. |
发明人 |
ETOH AKINORI;OIKE SETSUKO;ISHIZUKA TOMOKAZU;FUJII SHIGEHARU;SHINDO KIYOTAKA |
| 分类号 |
C09K3/14;B24B37/00;H01L21/304 |
主分类号 |
C09K3/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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