DIE BONDING APPARATUS HAVING MOUNT STAGE UNIT

摘要

A die bonding apparatus having a mount stage unit is provided to prevent pressure concentrated on corners of a die and damage of the die upon die bonding by configuring a mount stage surrounding the die. A mount stage(32) is attached on an upper of a mount stage body(30) and capable of bonding a die and a wire substrate with a bonding head. The die is received on a surface of the mount stage. A moving unit is connected to the mount stage body and capable of moving the mount stage. The mount stage surrounds the die received thereon with its surface area so that corners of the die and the mount stage are not contacted to each other, and prevents damage of the die.