发明名称 Method for forming ferrocapacitors and FeRAM devices
摘要 Ferrocapacitors having a vertical structure are formed by a process in which a ferroelectric layer is deposited over an insulator. In a first etching stage, the ferroelectric material is etched to form openings in it, leaving the insulating layer substantially intact. Then a conductive layer is deposited into the openings formed in the ferroelectric layer, forming electrodes on the sides of the openings. Further etching is performed to form gaps in the Al<SUB>2</SUB>O<SUB>3 </SUB>layer, for making connections to conductive elements beneath it. Thus, by the time the second etching step is performed; there are already electrodes overlying the sides of the ferroelectric material, without insulating fences in between.
申请公布号 US7316980(B2) 申请公布日期 2008.01.08
申请号 US20030678758 申请日期 2003.10.02
申请人 INFINEON TECHNOLOGIES AG 发明人 ZHUANG HAOREN;EGGER ULRICH;BRUCHHAUS RAINER;HORNIK KARL;LIAN JENNY;GERNHARDT STEFAN
分类号 H01L21/302;H01L21/02;H01L21/311;H01L21/8246;H01L27/115 主分类号 H01L21/302
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