发明名称 |
Wafer level package structure of optical-electronic device and method for making the same |
摘要 |
A wafer level package structure of optical-electronic device and method for making the same are disclosed. The wafer level package structure of optical-electronic device is provided by employing a substrate whose surfaces have several optical sensitive areas and divided into individual package devices. The manufacture steps first involve providing a substrate with several chips whose surfaces have an optical sensitive area and bonding pads, and providing transparent layer whose surfaces have conductive circuits and scribe lines. Then the bonding pads bond to conductive circuits and a protection layer is formed on the chip to expose partly conductive circuits. Forming a conductive film on the protection layer and the conductive film contacts with the extending conductive circuits to form the wafer level package structure of optical-electronic device. At last, the transparent layer is diced according to scribe lines to form the individual package devices.
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申请公布号 |
US7317235(B2) |
申请公布日期 |
2008.01.08 |
申请号 |
US20050082899 |
申请日期 |
2005.03.18 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
HUANG YUAN-CHANG;CHEN TAI-HUNG;LIN YAO-SHENG;LU SU-TSAI |
分类号 |
H01L31/0203 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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