发明名称 Memory device and method of manufacturing the same
摘要 In one embodiment, a memory device includes a semiconductor substrate, a first region formed in a predetermined region of the semiconductor substrate, and in which a plurality of memory transistors are disposed, and a second region adjacent to the first region, and in which a selection transistor is formed to supply a predetermined voltage to the memory transistor. The second region of the substrate may have a higher impurity concentration than an entire region of the substrate other than the second region. Reduced area of the selection transistor can be realized with a shortened channel length, without a decreased threshold voltage.
申请公布号 US7317223(B2) 申请公布日期 2008.01.08
申请号 US20050140298 申请日期 2005.05.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK WEON-HO
分类号 H01L21/8247;H01L29/792;H01L27/115;H01L29/423;H01L29/788 主分类号 H01L21/8247
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