Means of integrating a microphone in a standard integrated circuit process

摘要

A means of integrating a microphone on the same integrated circuit die as other electronics in the system is disclosed. The structure uses solder bump technology to form a gap between an electrode on the silicon and another electrode. Charge is stored on the capacitor so when pressure from sound waves causes one electrode to flex, the capacitance and therefore the charge changes, causing signal current. The structure allows for area efficiency by allowing placement of active silicon circuitry under the microphone.