发明名称 PROCESS AND EQUIPMENT FOR THE PRODUCTION OF PACKAGING MATERIAL FOR ELECTRONIC COMPONENT CASES
摘要 A process characterized by comprising the temporary bonding step of passing the first sheet (1) consisting of a laminate composed of a non-oriented thermoplastic resin film layer (4) and a thermoplastic adhesive resin layer (5) lying on one side of the layer (4) and the second sheet (2) consisting of a laminate composed of an oriented heat-resistant resin film layer (6) and an aluminum foil layer (7) lying on one side of the layer (6) between a pair of rolls (12, 13) in such a way that the layers (5, 7) are brought into contact with each other and pressing the sheets (1, 2) between the rolls (12, 13) under heating in such a state that the thermoplastic adhesive resin is not molten to bond the sheet (1) to the sheet (2) temporarily and thus form a prelaminated sheet (3) and the complete bonding step of heating the prelaminated sheet (3) to melt the thermoplastic adhesive resin and thereby unite the first and second sheets (1, 2) through adhesive bonding. This process brings about reduction in plant cost and enables high-speed production.
申请公布号 KR20080003391(A) 申请公布日期 2008.01.07
申请号 KR20077025352 申请日期 2006.04.28
申请人 SHOWA DENKO PACKAGING CO. 发明人 HATA HIROSHI
分类号 B29C65/40;B29C65/20;B32B15/08;B65D65/40 主分类号 B29C65/40
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