| 摘要 |
A film depositing apparatus for manufacturing semiconductor devices is provided to deposit an SOD layer on a wafer uniformly by forming plural spraying nozzles. A film depositing apparatus for manufacturing semiconductor devices using spin coating includes a chamber and plural spraying nozzles(10). The chamber includes a wafer(20). The spraying nozzles which are formed in an upper portion of the wafer are used for forming a layer on a surface of the wafer. The layer includes an SOD(Spin On Dielectric) layer. The spraying nozzles are installed in at least one of upper, lower, left, right, and center portions in the upper portion of the wafer.
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