APPARATUS FOR SUPPORTING A WAFER BEING OUT OF CONTACT WITH THE WAFER

摘要

An apparatus for supporting a wafer without contact with the wafer is provided to maintain maximally and uniformly a pressure distribution of the wafer by entirely distributing a plurality of air discharging outlets and air inhaling inlets. An apparatus for supporting a wafer without contact with the wafer includes a first member(100), a second member(200), a first air spraying pump, a second air spraying pump, and an air suction pump. The first member is a form of truncated corn having a larger diameter of a top surface than that of a bottom surface. A protrusion(110) and an indented portion(120) of a ring shape are repeatedly formed on the top surface of the first member according to a radial direction. An air channel(210) is formed on the first member by penetrating from each of the protrusion and the intended portion to the bottom surface. The second member has a shape of an empty truncated corn. An inner surface receives the first member and forms the air channel between the first members so as to be separated from an external surface of the first member at a predetermined interval. An upper portion has higher protrusion than that of the first member. The inside diameter of the upper portion has larger than a diameter of the wafer.