| 摘要 |
An FBGA(Fine-pitch Ball Grid Array) package is provided to eliminate a part of solder resist on a substrate and place an adhesive on the part so as to prevent defects in appearance and wire bonding caused by undesirable adhesive flowing, thereby improving the reliability of the FBGA package. An FBGA package includes a substrate(10), a semiconductor chip(11), a metal wire(7), an encapsulant(8), and a solder ball(9). The substrate has a cavity(5) and a circuit pattern. The semiconductor chip has a bonding pad(12) adhered to a type of a face-down by the medium of the adhesive on the substrate. The metal wire is formed to connect electrically the bonding pad of the semiconductor chip and the circuit pattern of the substrate passing the cavity of the substrate. The encapsulant is formed to enclose the upper surface of the substrate with the semiconductor chip and the cavity of the substrate with the metal wire. The solder ball adheres to the circuit pattern of a lower surface of the substrate.
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