| 摘要 |
A system-in-package structure for preventing a solder ball pad from being polluted and a method of fabricating the same are disclosed. The package structure includes a first package and a second package welded with each other. The first package has a carrier with plural solder ball pads and at least one integrated circuits (ICs) electrically connected to the carrier. A groove is formed around each solder ball pad and used to contain the overflowed sealing compound when the ICs are packaged on the first package by a sealing compound, so that the solder ball pad can avoid being polluted by the sealing compound. Thereby, the first package and second package are exactly electrical connected to each other and form a stacking structure.
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