发明名称 |
ELECTRONIC ASSEMLY AND METHOD FOR FORMING THE SAME |
摘要 |
Methods are provided for forming an electronic assembly (54). At least one depression (38) is formed in a surface of a substrate (20). A contact formation (44) is placed in the depression. A microelectronic die (46) is attached to the substrate using the contact formation. An electronic assembly is also provided. The invention further provides an electronic assembly. The electronic assembly (54) includes a substrate having a plurality of depressions formed thereon, a microelectronic die having a microelectronic device formed therein, and a plurality of contact formations bonded to and interconnecting the substrate and the microelectronic die. Each of the contact formations are positioned within a respective depression on the substrate. |
申请公布号 |
WO2007130706(A3) |
申请公布日期 |
2008.01.03 |
申请号 |
WO2007US60876 |
申请日期 |
2007.01.23 |
申请人 |
FREESCALE SEMICONDUCTOR INC.;GOGOI, BISHNU P.;SARIHAN, VIJAY |
发明人 |
GOGOI, BISHNU P.;SARIHAN, VIJAY |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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