发明名称 |
Power conversion device frame packaging apparatus and methods |
摘要 |
A plastic frame for converting a powered printed circuit board to an open frame power supply suitable for mounting on standoffs includes a ground plane that fits beneath the power supply combined with the solid plastic cover to electrically isolate the ground plane and a second printed circuit board providing the isolated ground plane with the powered printed circuit board matching standard power supply board and mounting dimensions.
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申请公布号 |
US2008002378(A1) |
申请公布日期 |
2008.01.03 |
申请号 |
US20070820476 |
申请日期 |
2007.06.18 |
申请人 |
WILLING STEVEN L;CARLSON KENT C;CAMPBELL ROBERT;AVENDANO ALBERTO |
发明人 |
WILLING STEVEN L.;CARLSON KENT C.;CAMPBELL ROBERT;AVENDANO ALBERTO |
分类号 |
H05K5/00;H02P1/00;H05K1/02;H05K1/14 |
主分类号 |
H05K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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