发明名称 Power conversion device frame packaging apparatus and methods
摘要 A plastic frame for converting a powered printed circuit board to an open frame power supply suitable for mounting on standoffs includes a ground plane that fits beneath the power supply combined with the solid plastic cover to electrically isolate the ground plane and a second printed circuit board providing the isolated ground plane with the powered printed circuit board matching standard power supply board and mounting dimensions.
申请公布号 US2008002378(A1) 申请公布日期 2008.01.03
申请号 US20070820476 申请日期 2007.06.18
申请人 WILLING STEVEN L;CARLSON KENT C;CAMPBELL ROBERT;AVENDANO ALBERTO 发明人 WILLING STEVEN L.;CARLSON KENT C.;CAMPBELL ROBERT;AVENDANO ALBERTO
分类号 H05K5/00;H02P1/00;H05K1/02;H05K1/14 主分类号 H05K5/00
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