发明名称 Scalable memory DIMM designs with vertical stackup connector
摘要 A plurality of memory modules are vertically stacked on a printed circuit board (PCB). Each memory module includes a socket located on a longitudinal side to receive an overlying memory module in the stack. Each memory module also includes a connecter underneath the socket to be inserted into a socket of an underlying memory module or the PCB. The front side of each memory module in the stack is substantially parallel to the front side of the PCB.
申请公布号 US2008002370(A1) 申请公布日期 2008.01.03
申请号 US20060480145 申请日期 2006.06.30
申请人 LAU WAI SHIN;OOI GIAP YONG 发明人 LAU WAI SHIN;OOI GIAP YONG
分类号 H05K7/00 主分类号 H05K7/00
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