发明名称 |
Scalable memory DIMM designs with vertical stackup connector |
摘要 |
A plurality of memory modules are vertically stacked on a printed circuit board (PCB). Each memory module includes a socket located on a longitudinal side to receive an overlying memory module in the stack. Each memory module also includes a connecter underneath the socket to be inserted into a socket of an underlying memory module or the PCB. The front side of each memory module in the stack is substantially parallel to the front side of the PCB.
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申请公布号 |
US2008002370(A1) |
申请公布日期 |
2008.01.03 |
申请号 |
US20060480145 |
申请日期 |
2006.06.30 |
申请人 |
LAU WAI SHIN;OOI GIAP YONG |
发明人 |
LAU WAI SHIN;OOI GIAP YONG |
分类号 |
H05K7/00 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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