| 摘要 |
A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on one or more layers. Conductor features of different geometries may be formed by imprinting them simultaneously on one or both surfaces of an imprintable tape. Fabrication apparatus and methods, as well as application of the imprinted package to an electronic assembly, are also described.
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