发明名称 MOUNTING STRUCTURE FOR PRINTED BOARD
摘要 <p>A mounting structure for a printed board, where, when the printed board on which components are mounted is fixed to a fixed structure such as a housing, mechanical stress in solder joints of components soldered on the printed substrate is mitigated and where the space of the printed board can be effectively used to adapt the board to high density mounting. The mounting structure has cushioning sections (20, 22, 24) near the vicinity of fixation holes (14) for fixing the printed board (10) to the fixed structure. The cushioning sections are formed as slits or grooves and absorb stress caused by the fixing.</p>
申请公布号 WO2008001462(A1) 申请公布日期 2008.01.03
申请号 WO2006JP313108 申请日期 2006.06.30
申请人 FUJITSU LIMITED;HIRANO, YOSHIKAZU 发明人 HIRANO, YOSHIKAZU
分类号 H05K1/02 主分类号 H05K1/02
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