发明名称 |
FLEXIBLE JOINT METHODOLOGY TO ATTACH A DIE ON AN ORGANIC SUBSTRATE |
摘要 |
<p>In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic substrate, an interposer coupled with a surface of the organic substrate, the interposer having cavities to accept bumps of a die, and a flexible tape layer coupled with a surface of the interposer, the flexible tape layer to couple with bumps of the die. Other embodiments are also disclosed and claimed.</p> |
申请公布号 |
WO2008002944(A1) |
申请公布日期 |
2008.01.03 |
申请号 |
WO2007US72164 |
申请日期 |
2007.06.26 |
申请人 |
INTEL CORPORATION;OGATA, KAZUO;FUKUO, TSUYOSHI;ISHIYAMA, SEIJI;KOH, TETSUHIDE |
发明人 |
OGATA, KAZUO;FUKUO, TSUYOSHI;ISHIYAMA, SEIJI;KOH, TETSUHIDE |
分类号 |
H01L23/02;H01L21/52 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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