FABRICATION OF THREE DIMENSIONAL INTEGRATED CIRCUIT EMPLOYING MULTIPLE DIE PANELS

摘要

A method of assembling an electronic device includes testing (602) a first wafer (100) of first die to identify the location of functional first die and dividing (604) the first wafer (100) into a set of panels (104-1, 104-2, 104-3), wherein a panel includes an MxN array of first die. A panel is bonded to a panel site of a second wafer to form a panel stack wherein a panel site defines an MxN array of second die in the second wafer. The panel stack is sawed (606) into a devices comprising a first die bonded to a second die. Dividing the first (100) wafer into panels may be done according statically or dynamically (to maximize the number of panels having a yield exceeding a specified threshold). Binning of the panels and panel sites according to functional die patterns may be performed to preferentially bond panels to panel sites of the same bin.