A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.
申请公布号
WO2008003051(A2)
申请公布日期
2008.01.03
申请号
WO2007US72381
申请日期
2007.06.28
申请人
ANALOG DEVICES, INC.;ZHANG, XIN;JUDY, MICHAEL;CHAU, KEVIN, H.L.;KUAN, NELSON;SPOONER, TIMOTHY;PAYDENKAR, CHETAN;FARRELL, PETER
发明人
ZHANG, XIN;JUDY, MICHAEL;CHAU, KEVIN, H.L.;KUAN, NELSON;SPOONER, TIMOTHY;PAYDENKAR, CHETAN;FARRELL, PETER
