发明名称 METHOD FOR MAMUFACTURING A TRANSPARENT CAPILLARY FOR SEMICONDUCTOR WIRE BONDING USING INJECTION MOLDING AND CAPILLARY FOR SEMICONDUCTOR WIRE BONDING USING THEREOF
摘要 A method for manufacturing a transparent capillary using injection molding and the transparent capillary manufactured by the same are provided to improve the wear resistance and durability thereof by preparing and molding slurry. 75wt.% or 85wt.% compound powder of alumina-chromium oxide-magnesium oxide is mixed with a binder to prepare slurry(100). The slurry is formed in a capillary shape through injection molding(200). The formed capillary is put in a degreasing furnace and is heated to 200 to 800 deg.C to eliminate the binder. Then, the capillary is gradually heated to 1000 to 1550 deg.C and then is passively cooled(400). The sintered capillary is gradually heated to 1250 to 1500 deg.C under predetermined pressure, and then is passively cooled(500).
申请公布号 KR100791222(B1) 申请公布日期 2008.01.03
申请号 KR20060019588 申请日期 2006.02.28
申请人 发明人
分类号 H01L21/60;B29C45/00 主分类号 H01L21/60
代理机构 代理人
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